| 1.In order to prevent the damage,
the edge can not be touched by hand or other objects when
the blade is taken from the box.
2.The first use of new blade must obey the rule of
the technology of repair.
3.When blade needs repairing, special-purpose repair-plate
must be used.
4.The technology of repair: The depth of the first
repair is 0.1mm. The speed of the repair-plate along
the X dimension gradually increases from the low velocity
about 10mm/s to above the speed of cutting silicon wafer.
(The highest speed of cutting silicon wafer had better
no more than 40~50mm/s) Each gear of speed needs repairing
2~3 times, and the whole needs about 20 times. The depth
of the second repair must be more than that of cutting
silicon wafer about 0.05mm. (if the depth of cutting
silicon wafer is 0.25mm, then the depth of repair is
0.30mm). The adjustment of the speed of the repair-plate
is just as that of the first repair.
5.The speed of blade which has been repaired, according
to the required cutting depth, must gradually increases
on the useless silicon wafer till it reaches the proper
speed. After the quality of cutting properties satisfied
technology demands, the blade can be used for the normal
cutting of silicon wafer.
6.When cutting, the blade must be cooled sufficiently
by clean water of which flow is no less than 2.41/min,
otherwise it will affect cutting quality and the
life of blade.
7.Blade line volecity: more than 80m/s (30000 R.P.M) |
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