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[Type]:  A  B  C  D  E  F  G  H  I  J
(F) Diamond Resin-bond Blades

Photo Outer diameter Hole
diameter

(mm)
Thickness (mm) Diamond grain size Application Scope
inch mm
  2"-6" 50-152 25.4-114 0.2-4 5-60

240# 280#

used to cut high hardness and expensive nonmetal material, such as silicium, germanium, semi-conduct material, etc.
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