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(C) Diamond Plated Saw Blades

Photo Order No. Diameter
(mm)
Hole
(mm)
Segregate Thickness
(mm)
Base Thickness
(mm)
Quantity of fixing holes Application Scope
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ID206 206 83 0.25 0.1 18 For cutting hard materials, such as:

1. Various kinds of silicon wafers.

2. Germanium

3. Glass

4. Ferrites

5. Lithium niodate.

6. Lithium tantalate

7. Many kinds of ceramics and so on

ID246-90A 246 90 0.25 0.1 18
ID246-90B 246 90 0.25 0.1 22
ID246-90C 246 90 0.25 0.1 40
ID246-83A 246 83 0.25 0.1 22
ID246-83B 246 83 0.25 0.1 18
ID271 271 90 0.25 0.1 26
ID360 360 20 0.27 0.1 34
ID380 380 130 0.27 0.1, 0.12 34
ID390 390 130 0.27 0.1, 0.12 39
ID422 422 153 0.31 0.1, 0.12 39
ID422 422 153 0.26, 0.31 0.1, 0.12 39
ID422 422 153 0.27, 0.31 0.1, 0.12 51
ID546 546 184 0.30, 0.31 0.12 51
ID546 546 184 0.29, 0.32 0.12, 0.15 48
ID558-1 558 184 0.30, 0.31 0.12 48
ID558-2 558 203 0.30, 0.31 0.12 48
ID558-11 558 184 0.29, 0.32 0.12, 0.15 48
ID588-22 558 203 0.29, 0.32 0.12, 0.15 48
ID596 596 203 0.30, 0.31 0.12, 0.15 48
ID596 596 203 0.29, 0.32 0.12, 0.15 48
ID690 690 235 0.30, 0.31 0.15 78
ID690 690 235 0.29, 0.33 0.15, 0.17 78
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